Home » Thermal Product Solutions » High Performance Graphene
Leader Tech’s TGN series are a new ultra-thin thermal pad with low thermal resistance. This thermal pad is fabricated by combining graphene and silicone. The materials are arranged in the polymer matrix in an orderly manner to form a good thermally conductive path, which greatly improves the efficiency of heat conduction. In addition, this material has high resiliency and low density which can be used as a replacement of thermal grease material .
How to order product to size:
WWWW = Width in inches (ex 5.00″ = 0500)
LLLL = Length in inches (ex 10.00″ = 1000)
TTT = Thickness in inches (ex 0.040″ = 040)
Example: TGN1300-05001000-040
Part numbers will be provided in inches
Applications:
Features & Benefits:
Standard Thickness:
TGN700: 0.010″, 0.020″, 0.030″
TGN900: 0.010″, 0.020″, 0.030″
TGN1300: 0.010″, 0.020”
Leader Tech Series | TGN700 | TGN900 | TGN1300 |
---|---|---|---|
Thermal Conductivity Z (W/m-K) | 70 | 90 | 130 |
Thermal Conductivity Y (W/m-K) | 25 | 25 | 25 |
Thermal Conductivity X (W/m-K) | 600 | 600 | 600 |
Thermal Resistance (°C-in^2/W; @20Psi) | ≤ 0.090 | ≤ 0.070 | ≤ 0.050 |
Color | Black | Black | Black |
Thickness (in) | 0.008 - 0.031 | 0.008 - 0.031 | 0.008 - 0.020 |
Density (lb/in^3) | 0.022 | 0.022 | 0.036 |
Compression Ratio @50 Psi (%) | ≥ 50 | ≥ 50 | ≥ 25 |
Operating Temperature (°F) | -40 to 302 | -40 to 302 | -40 to 302 |
Leader Tech Series | TGN700 | TGN900 | TGN1300 |
---|---|---|---|
Thermal Conductivity Z (W/m-K) | 70 | 90 | 130 |
Thermal Conductivity Y (W/m-K) | 25 | 25 | 25 |
Thermal Conductivity X (W/m-K) | 600 | 600 | 600 |
Thermal Resistance (°C-in^2/W; @20Psi) | ≤ 0.090 | ≤ 0.070 | ≤ 0.050 |
Color | Black | Black | Black |
Thickness (mm) | 0.2 - 0.8 | 0.2 - 0.8 | 0.2 - 0.5 |
Density (g/cc) | 0.6 | 0.6 | 1 |
Compression Ratio @50 Psi (%) | ≥ 50 | ≥ 50 | ≥ 25 |
Operating Temperature (°C) | -40 to 150 | -40 to 150 | -40 to 150 |
Leader Tech is a world leading innovator and manufacturer of EMI shielding products for circuit boards, electronic enclosures, thermal products, microwave absorbers and interconnect cables.