USA-Made

LeaderTech

Solid Round Strip

Solid Round Strip for EMI/RFI Shielding Extrusions

Leader Tech’s Solid Round Strip solutions include TechSIL round and hollow round EMI/RFI shielding extrusions engineered for reliable sealing and performance. These profiles come in more than thirty sizes to fit a wide range of applications.

To ensure proper performance, device designs should include grooves. Grooves help prevent over-compression and extend the life of the Solid Round Strip gasket.

Flexible Bonding and Design Options

Both round and hollow round Solid Round Strip profiles can be bonded into O-rings using RTV cold bonding or hot vulcanized bonding methods.

For best results, bonded O-rings should have an inside diameter greater than 2 inches. If smaller sizes are required, our engineering team can provide custom solutions.

Performance and Application Benefits

The hollow round profile offers a wider operating range and requires lower compression forces, making it ideal for applications where flexibility and durability are critical.

Please note that Solid Round Strip profiles do not support pressure-sensitive adhesive, and tape options are not available. Additional sizes can be provided upon request to meet specific application needs.

Solid Round Strip

Total Mass Loss (TML): In general, the material is considered acceptable if the total mass loss (TML) is less than 1% and the volatile condensable mass (VCM) is less than
0.1% of the initial sample mass.
Collected Volatile Condensable Materials (CVCM): If the CVCM exceeds 0.1%, the material fails.
Water Vapor Regained (WVR): If the difference between the TML and the WVR does not exceed 1.0% (and the CVCM does not exceed 0.10%), the material passes the test.

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