Mushroom Extrusions

Mushroom Extrusions:

TechSIL Mushroom Extrusions are available in ten different profiles. They can be used in a large groove to control the compression forces or can have either Conductive or non-Conductive Pressure Sensitive Adhesive applied for easy assembly. When using a non-Conductive Adhesive only 50% of the mating surface should have PSA applied. The Mushroom Extrusion can be bonded into O-Rings or Picture Frame gaskets using an RTV cold bond or a Hot Vulcanized bond.