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LeaderTech

Hollow P Strip

Hollow P Strip for EMI/RFI Shielding Applications

Hollow P Strip solutions from Leader Tech include TechSIL EMI/RFI shielding conductive elastomer extrusions. These profiles are available in eight different sizes to fit a variety of applications.

These Hollow P Strip profiles can be installed in grooves to control compression forces. In addition, they can be supplied with conductive or non-conductive pressure-sensitive adhesive for easy assembly.

Adhesive and Installation Flexibility

When using non-conductive adhesive, only 80% of the mating surface should have pressure-sensitive adhesive applied. This helps maintain proper electrical performance.

PSA can also be applied to either side of the Hollow P Strip, allowing flexible installation in different positions within your device.

Bonding and Performance Benefits


Hollow P Strip extrusions can be bonded into picture frame gaskets using RTV cold bonding or hot vulcanized bonding methods. As a result, they provide strong and reliable sealing.

The hollow “P” profile offers a wide operating range and requires low compression force. Therefore, it is ideal for applications that need flexibility and consistent performance.

Solid versions and additional sizes of Hollow P Strip profiles are available upon request to meet specific design requirements.

For technical questions or support, contact sales@leadertechinc.com

Hollow P Strip

Total Mass Loss (TML): In general, the material is considered acceptable if the total mass loss (TML) is less than 1% and the volatile condensable mass (VCM) is less than
0.1% of the initial sample mass.
Collected Volatile Condensable Materials (CVCM): If the CVCM exceeds 0.1%, the material fails.
Water Vapor Regained (WVR): If the difference between the TML and the WVR does not exceed 1.0% (and the CVCM does not exceed 0.10%), the material passes the test.

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