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Thermal Product Solutions

High Performance Carbon Fiber

High Performance Carbon Fiber

Leader Tech’s TCF series are a new ultra-thin carbon fiber thermal pad with low thermal resistance. This thermal pad mainly uses carbon fiber as a thermally conductive filler by producing the carbon fiber vertically arranged in the polymer matrix to form a thermal conduction path in the vertical direction, greatly enhancing the heat transfer efficiency. In addition, the ultrathin carbon fiber thermal pad is highly flexible, which can be used as a replacement of thermal grease material .

How to order product to size:
WWWW = Width in inches (ex 5.00″ = 0500)
LLLL = Length in inches (ex 10.00″ = 1000)
TTT = Thickness in inches (ex 0.040″ = 040)
Example: TCF160-05001000-040
Part numbers will be provided in inches

Applications:

  • Graphic Processors
  • Base stations
  • Microprocessors
  • Telecommunications

Features & Benefits:

  • Soft Surface
  • Good compressibility
  • Low thermal impedance
  • Good thermal stability

Standard Thickness:

TCF160: 0.010”, 0.020”, 0.030”, 0.039”, 0.059”, 0.079”, 0.098”, 0.118”

TCF200: 0.020”, 0.030”, 0.039”, 0.059”, 0.079”, 0.098”, 0.118”

TCF250: 0.020”, 0.030”, 0.039”, 0.059”, 0.079”, 0.098”, 0.118”

TCF350: 0.010”, 0.020”, 0.030”