High Temperature Fabric Over Foam Gasket for EMI/RFI Shielding
High Temperature Fabric Over Foam Gaskets are EMI/RFI shielding solutions designed for demanding electronic applications. These high temperature fabric over foam EMI gaskets combine conductive fabric, resilient foam cores, and excellent shielding performance for access panels, connectors, backplanes, and electronic enclosures.
Material Characteristics
- Copper and Nickel Fabric: 0.0037 +/- 0.0004 in (0.095 +/- 0.01 mm)
- Hi temp hot melt adhesive : 0.0035 +/- 0.0004 in (0.090 +/- 0.01 mm)
- Urethane foam core
- Hardness: 80+/-10 ASKER
- Density: 0,0016 +/- 0.0002 lb/in³ (45 +/- 5 kg/m³)
- Non-Conductive PSA: 0.0019 +/- 0.0004 in (0.048 +/- 0.01 mm)
- Peel Strength: ≥ 2.9 lb/in
- Halogen Free
Applications
- Intricate die cut forms
- I/O panels
- Backplanes
- Connectors
- Access panels