USA-Made

LeaderTech

Hollow D Strip

Hollow D Strip for EMI/RFI Shielding Applications

Hollow D Strip solutions from Leader Tech include TechSIL solid and hollow “D” EMI/RFI shielding conductive elastomer extrusions. These profiles are available in nineteen different options to support a wide range of applications.

These Hollow D Strip profiles can be installed in grooves to control compression forces. In addition, they can be supplied with conductive or non-conductive pressure-sensitive adhesive for easy assembly.

Flexible Bonding and Assembly Options

Both solid and hollow Hollow D Strip profiles can be bonded into O-rings or picture frame gaskets. This can be done using RTV cold bonding or hot vulcanized bonding methods.

When using non-conductive adhesive, only 50% of the mating surface should have pressure-sensitive adhesive applied. This helps maintain proper electrical performance.

Performance and Design Benefits


The hollow “D” profile offers a wider operating range and requires lower compression forces compared to solid versions. As a result, it provides better flexibility and durability in demanding applications.

Additional sizes of Hollow D Strip profiles are available upon request to meet specific application needs.

Hollow D Strip

Total Mass Loss (TML): In general, the material is considered acceptable if the total mass loss (TML) is less than 1% and the volatile condensable mass (VCM) is less than
0.1% of the initial sample mass.
Collected Volatile Condensable Materials (CVCM): If the CVCM exceeds 0.1%, the material fails.
Water Vapor Regained (WVR): If the difference between the TML and the WVR does not exceed 1.0% (and the CVCM does not exceed 0.10%), the material passes the test.

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