Slot-Lok Multi-Cavity PCB Shield Solutions
Leader Tech’s Slot-Lok Form Down Multi-Cavity shields are engineered for PCB applications requiring multiple isolated shielding compartments within a compact board level design. These low profile shielding solutions provide reliable EMI/RFI protection while maintaining design flexibility for complex electronic assemblies.
The multi-cavity design allows engineers to isolate sensitive components and reduce electromagnetic interference between sections of the PCB. Manufactured using RoHS compliant materials, these shields deliver excellent solderability, corrosion resistance, and dependable shielding effectiveness.
Features & Benefits
- Variety of cover retention methods
- Pull tabs for ease of cover removal
- Custom access holes and notches
- Ventilation holes for cover
- Multiple finish plating options
- Low profile Slot-Lok™ design
- Short lead time
- Through-hole or surface mount
- Tape and reel packaging for automatic placement available
- Ideal for applications with height restrictions under .150”
Slot-Lok Form Down Multi-Cavity Specifications
- Material Thickness: .010” (.25), .012” (.31) or .015” (.38)
- Std Material: Pre-Tin plated steel, Alloy 770 (UNS C77000), HYMU 80
- Shielding Effectiveness: up to 60 dB
Options
- Pre-Tin plated steel to the material options
Edge Options
Corner Configuration
Ventilation Holes
Pick Spot
Dimple & Slots
Pull Tabs
