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LeaderTech

Board Level Shielding
Circuit-Board-Shielding

Board Level Shielding Solutions for Electronic Applications

Board Level Shielding is one of the most effective ways to control EMI and RFI in electronic devices. It helps protect sensitive components and improves overall performance.

These shielding solutions use precision metal covers to create a Faraday cage around critical circuit board components. As a result, they contain unwanted emissions at the source and reduce interference.

In addition, capturing EMI and RFI early helps minimize the need for expensive enclosure-level shielding. This not only lowers costs but also improves design flexibility.

Leader Tech offers a wide range of Board Level Shielding solutions for different electronic applications. Our products are designed for reliability, performance, and easy integration.

If you have technical questions or need support, please contact our team at sales@leadertechinc.com

Board Level Shielding Selection Guide

Circuit Board Shield Design Guide

Leader Tech is a manufacturing innovator focused on constant improvement and refinement of proven product platforms and manufacturing methods. This allows us to deliver cost-effective shielding solutions that solve EMI problems for both current and emerging electronic applications. From small footprints and low-profile applications to multi-level board designs, we offer a wide selection of standard, modified standard and custom board level shielding products to fit your exact specifications. Our most popular product lines are described below in our Design Guide.

Frequently Asked Questions About Board Level Shielding

What is board level shielding?

Board level shielding uses conductive metal shields to control electromagnetic interference and radio frequency interference around specific components or sections of a printed circuit board. By containing emissions close to the source, these shields help protect sensitive circuitry and reduce interference between nearby components.

Board level shielding should be considered when individual PCB components generate electromagnetic emissions or are sensitive to interference from nearby circuitry. It is commonly used in compact, high-frequency and densely populated electronic designs where localized EMI control is needed.

Board level shielding provides localized EMI protection around selected components or circuits on a PCB. Enclosure shielding protects a larger electronic assembly at the system or housing level. Controlling interference at the board level can reduce the amount of shielding required elsewhere in the finished device.

A one-piece shield is typically soldered directly to the PCB and is best suited for applications that do not require frequent access to the components underneath. A two-piece shield uses a soldered frame with a removable cover, allowing components to be inspected, adjusted, repaired or replaced after installation.

Shield selection depends on the PCB layout, component height, available board space, required access, production volume and assembly process. Engineers should also consider whether the application requires a standard size, a modified standard design or a fully custom shield.

A board level shield must have a reliable connection to the PCB ground plane to control EMI effectively. The number, placement and spacing of ground connections can affect shielding performance. Inconsistent grounding or large gaps between contact points may allow electromagnetic energy to enter or escape.

Yes. Multi-cavity shields can separate different components or functional areas within the same shield. Internal partitions help reduce interference between circuits while allowing several components to be protected within a single board level shielding structure.

Yes. Shields can be designed with ventilation holes, access openings, notches and other features when required by the application. These features must be carefully sized and positioned because openings can affect shielding performance, particularly at higher frequencies.

Certain board level shields are designed for automated surface-mount assembly and can be supplied in tape-and-reel packaging. This allows the shields to be placed using automated pick-and-place equipment and soldered during the standard reflow process.

Yes. Board level shields can be customized for specific dimensions, component heights, PCB layouts, materials and production requirements. Custom options may include one-piece or two-piece construction, low-profile designs, multiple cavities, removable covers and application-specific openings or features.

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