Call Toll Free: 866.832.4364

Thermal Product Solutions

High Performance Indium

High Performance Indium

Leader Tech’s TCI series is a new type of composite indium sheet capable of transitioning from solid
to liquid at its melting point and back to solid again at room temperature. Capable of uniform thermal
resistance at compressed environments where low stress is applied.

How to order product to size:

WWWW = Width in inches (ex 5.00″ = 0500)

LLLL = Length in inches (ex 10.00″ = 1000)

TTT = Thickness in inches (ex 0.040″ = 040)

Example: TCI800-05001000-040

Part numbers will be provided in inches

Applications:

  • Graphic Processors
  • Base stations
  • Microprocessors
  • Laptops, CPU/APUs

Features & Benefits:

  • Low pressure capabilities
  • Low thermal resistance
  • Good thermal stability

Standard Thickness:

TCI800: 0.008″, 0.020”

Leader Tech Series TCI800
Thermal Conductivity Z (W/m-K) ≥ 80
Thermal Conductivity X,Y (W/m-K) 80
Thermal Resistance (°C-in^2/W; @10Psi) ≤ 0.055
Color Bright Silver
Thickness (in) 0.008 - 0.020
Density (lb/in^3) 0.264
Operating Temperature (°F) -58 to 932
Melting Point Range (°F) 80 deg C

Place an Order

1. Customize product to size

Indium Standard Thicknesses

  • TCI800: 0.008″ – 0.020″

Customize Product Size (Example)

Product Example = TGN160
Width in inches (ex 1.10″ = 0110)
Length in inches (ex 02.25″ = 0225)
Thickness in inches (ex 0.040″ = 040)

Part Number (Example)

How to order product to size TGN

2. Order direct from Leader Tech or from a distributor

To order direct from Leader Tech Inc. 

Leader Tech Inc Icon

Call Toll Free  866.832.4364
Email Sales at sales@leadertechinc.com
Questions? Contact our Applications Engineers

To order from our Distributors

Trusted Parts

Trusted Parts
Search all Leader tech Parts TrustedParts.com
Questions? Contact our Applications Engineers

the latest on emi/rfi SHEILDING SOLUTIONS &
thermal MANAGEMENT

Subscribe to our FREE E-Newsletter designed to inform & educate. Delivered to you once every 2-Weeks. Enter your email below.