Control EMI/RFI at the circuit board level while supporting efficient assembly and reliable testing outcomes.
In high-speed, high-density designs, EMI/RFI issues often don’t appear until late in development—during compliance testing or system integration—when design changes are costly. At that stage, shielding performance depends less on theory and more on how shielding is implemented within the layout, grounding strategy, and mechanical constraints of the board.
Surface mount shielding allows emissions to be contained close to the source, but results vary based on integration details that are easy to overlook early in the design process.
In practice, surface mount shielding performance is shaped by access requirements, airflow considerations, grounding continuity, and how the shield interacts with surrounding components. Decisions made at the layout stage often determine whether shielding stabilizes EMI performance—or introduces new constraints during testing and production.
Depending on these requirements, surface mount shielding may be implemented using one-piece or two-piece configurations, each offering different tradeoffs between simplicity, accessibility, and flexibility.
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When Simplicity and Stability Matter Most
In designs where access to shielded components is not required after assembly, one-piece surface mount shields offer a straightforward, stable solution. By soldering directly to the PCB, these shields create a continuous conductive enclosure that minimizes variables during testing and production.
One-piece configurations are often selected when layouts are mature, component placement is finalized, and the priority is consistent EMI/RFI performance with minimal mechanical complexity. With fewer interfaces and no removable elements, they can reduce potential failure points while supporting repeatable results across builds.
When Access and Flexibility Are Part of the Design
For designs that require access during development, tuning, or service, two-piece surface mount shields provide additional flexibility without sacrificing shielding performance. A soldered frame establishes a reliable grounding path, while a removable cover allows components to be accessed as needed.
This approach is commonly used when iteration is expected, diagnostics are required during validation, or post-assembly adjustments may be necessary. The tradeoff is added mechanical complexity, but for many designs, the ability to open and reseal the shield outweighs that cost—especially during testing and early production.
Applied Across EMI-Sensitive Electronic Systems
Surface mount shielding is commonly used in electronic systems where EMI/RFI control, compact integration, and reliable performance are required. In applications such as medical equipment, communications hardware, automotive electronics, and industrial systems, surface mount shields help protect sensitive circuitry within space-constrained designs.