TechSIL Solid and Hollow “D” EMI/RFI Shielding Conductive Elastomer Extrusions are available in nineteen different profiles. They can be used in a groove to control the compression forces or can have either Conductive or non-Conductive Pressure Sensitive Adhesive applied for easy assembly. When using a non-Conductive Adhesive only 50% of the mating surface should have PSA applied. Both the Solid and Hollow variations can be bonded into O-Rings or Picture Frame gaskets using an RTV cold bond or a Hot Vulcanized bond. The Hollow “D” profiles offers a much wider operating range and lower compression forces are required than for the Solid versions. Additional sizes are available upon request.