As engineers push the limits of circuit board design, they struggle to integrate more components within a reduced footprint. Many times this leads to extremely complex board layouts with advanced components such as GPS and cellular chip sets in close proximity.
To reduce unwanted RFI/EMI emissions and elevate cross-talk between components, Leader Tech offers their Multi-Cavity Slot-Lok™ Pro Shield. This proprietary board-level shielding product uses standardized manufacturing methods to create near custom multi-cavity solutions with minimal nonrecurring engineering charges (NRE) and virtually limitless customization options.
Leader Tech’s Multi-Cavity Slot-Lok™ Pro series is constructed from a solid, RoHS compliant frame and a removable high-retention cover. This allows engineers to effectively combine multiple shields under the same footprint saving space, weight, assembly cost and time-to-market. The 2-piece frame and removable cover construction also facilitates easy rework and inspection processes.
In addition to offering up to 60 dB of shielding effectiveness (SE), the shields are quickly installed using through-hole or surface mount soldering.